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Diodes / Transient Suppressors / DF2B7BSL,L3F
Datasheets
DF2B7BSL,L3F by: Toshiba America Electronic Components

Trans Voltage Suppressor Diode

Part Details for DF2B7BSL,L3F by Toshiba America Electronic Components

Results Overview of DF2B7BSL,L3F by Toshiba America Electronic Components

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DF2B7BSL,L3F Information

DF2B7BSL,L3F by Toshiba America Electronic Components is a Transient Suppressor.
Transient Suppressors are under the broader part category of Diodes.

A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.

Price & Stock for DF2B7BSL,L3F

Part # Distributor Description Stock Price Buy
DISTI # 264-DF2B7BSLL3FCT-ND
DigiKey TVS DIODE 5.5VWM 16VC SL2 Min Qty: 1 Lead time: 12 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) 21672
In Stock
  • 1 $0.1200
  • 10 $0.0810
  • 100 $0.0350
  • 500 $0.0330
  • 1,000 $0.0310
  • 2,000 $0.0300
  • 5,000 $0.0290
  • 10,000 $0.0250
  • 20,000 $0.0187
$0.0187 / $0.1200 Buy Now
DISTI # DF2B7BSL,L3F
Avnet Americas ESD Suppressor TVS Single Bi-Dir ?30kV 2-Pin SOD-962 Emboss T/R - Tape and Reel (Alt: DF2B7BSL,L3F) RoHS: Compliant Min Qty: 10000 Package Multiple: 10000 Lead time: 12 Weeks, 0 Days Container: Reel 30000
  • 10,000 $0.0100
$0.0100 Buy Now
DISTI # 757-DF2B7BSL,L3F
Mouser Electronics ESD Protection Diodes / TVS Diodes Ipp: 7.3A Vrwm 5V Bi-Dir ESD Protectn RoHS: Compliant 15358
  • 1 $0.1200
  • 10 $0.0810
  • 100 $0.0350
  • 1,000 $0.0310
  • 2,500 $0.0290
  • 10,000 $0.0250
  • 20,000 $0.0180
$0.0180 / $0.1200 Buy Now

Part Details for DF2B7BSL,L3F

DF2B7BSL,L3F CAD Models

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DF2B7BSL,L3F Part Data Attributes

Parametric Data
DF2B7BSL,L3F Toshiba America Electronic Components
Buy Now Datasheet
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DF2B7BSL,L3F Toshiba America Electronic Components Trans Voltage Suppressor Diode
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TOSHIBA CORP
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Factory Lead Time 12 Weeks
Samacsys Manufacturer Toshiba
Breakdown Voltage-Max 7.8 V
Breakdown Voltage-Min 5.6 V
Breakdown Voltage-Nom 6.8 V
Clamping Voltage-Max 16 V
Configuration SINGLE
Diode Element Material SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code R-PDSO-N2
Non-rep Peak Rev Power Dis-Max 115 W
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity BIDIRECTIONAL
Reference Standard IEC-61000-4-2, 4-5
Rep Pk Reverse Voltage-Max 5.5 V
Reverse Current-Max 0.1 µA
Reverse Test Voltage 5.5 V
Surface Mount YES
Technology AVALANCHE
Terminal Form NO LEAD
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

DF2B7BSL,L3F Frequently Asked Questions (FAQ)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.

  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and management practices. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, derating the device's power dissipation and operating frequency can help reduce thermal stress.

  • Toshiba recommends soldering the DF2B7BSL,L3F using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. The device should be soldered using a solder with a melting point of 217°C (423°F) or higher. Hand soldering is not recommended due to the risk of overheating the device.

  • To prevent ESD damage, it's essential to handle the device with proper ESD protection measures, such as using an ESD wrist strap, ESD mat, or ESD-protected workbench. The device should be stored in an ESD-protected package, and all personnel handling the device should be grounded.

  • Operating the DF2B7BSL,L3F beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and increased risk of device failure. This includes operating the device at temperatures, voltages, or frequencies beyond the specified ranges. It's essential to follow the recommended operating conditions to ensure reliable operation and prevent premature device failure.