Part Details for DAC088S085CISQX by National Semiconductor Corporation
Overview of DAC088S085CISQX by National Semiconductor Corporation
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Part Details for DAC088S085CISQX
DAC088S085CISQX CAD Models
DAC088S085CISQX Part Data Attributes
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DAC088S085CISQX
National Semiconductor Corporation
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DAC088S085CISQX
National Semiconductor Corporation
IC SERIAL INPUT LOADING, 3 us SETTLING TIME, 8-BIT DAC, PQCC16, LLP-16, Digital to Analog Converter
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | LLP-16 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Analog Output Voltage-Max | 5.5 V | |
Analog Output Voltage-Min | ||
Converter Type | D/A CONVERTER | |
Input Bit Code | BINARY | |
Input Format | SERIAL | |
JESD-30 Code | S-PQCC-N16 | |
JESD-609 Code | e0 | |
Length | 4 mm | |
Linearity Error-Max (EL) | 0.1953% | |
Moisture Sensitivity Level | 1 | |
Number of Bits | 8 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC20,.16SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.8 mm | |
Settling Time-Max | 4.5 µs | |
Settling Time-Nom (tstl) | 3 µs | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 4 mm |