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Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit, VFBGA100, 5000/Tape & Reel
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Manufacturer | Description | Datasheet |
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DA14699-00000HR2 | Renesas Electronics Corporation | Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit | |
DA14699-00HRDB-P | Renesas Electronics Corporation | SmartBond™ DA14695 Bluetooth® Low Energy 5.2 Development Kit Pro - VFBGA100 Daughterboard | |
DA14697-00000HR2 | Renesas Electronics Corporation | Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit |
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
DA14699-00000HR2CT-ND
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DigiKey | IC RF TXRX+MCU BLE 100VFBGA Min Qty: 1 Lead time: 13 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
9995 In Stock |
|
$4.7000 / $10.6000 | Buy Now |
DISTI #
DA14699-00000HR2
|
Avnet Americas | Multi-core BLE 5.1 SoC family with system PMU - Tape and Reel (Alt: DA14699-00000HR2) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 24 Weeks, 0 Days Container: Reel | 0 |
|
$5.0008 / $5.4520 | Buy Now |
DISTI #
724-DA14699-00000HR2
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Mouser Electronics | RF System on a Chip - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols RoHS: Compliant | 5000 |
|
$4.5600 / $8.8300 | Buy Now |
|
Renesas Electronics America | IC RF TXRX+MCU BLE 100VFBGA Min Qty: 1 Container: Tape & Reel (TR) | 9995 |
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$4.7000 / $10.6000 | Buy Now |
DISTI #
DA14699-00000HR2
|
Avnet Silica | (Alt: DA14699-00000HR2) RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 25 Weeks, 0 Days | Silica - 0 |
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Buy Now |
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DA14699-00000HR2
Renesas Electronics Corporation
Buy Now
Datasheet
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DA14699-00000HR2
Renesas Electronics Corporation
Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit, VFBGA100, 5000/Tape & Reel
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | VFBGA100 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 24 Weeks | |
Samacsys Manufacturer | Renesas Electronics | |
Additional Feature | 100/1000 (samples) AVAILABLE | |
JESD-30 Code | S-PBGA-B100 | |
Length | 5 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 100 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA100,10X10,19 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Seated Height-Max | 0.92 mm | |
Supply Voltage-Max | 4.75 V | |
Supply Voltage-Min | 2.4 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.475 mm | |
Terminal Position | BOTTOM | |
Width | 5 mm | |
uPs/uCs/Peripheral ICs Type | Bluetooth SoC |