There are no models available for this part yet.
Overview of CYW15G0401DXB-BGXC by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Price & Stock for CYW15G0401DXB-BGXC by Cypress Semiconductor
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Rochester Electronics | Telecom Circuit, 4-Trnsvr, BICMOS, PBGA256 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 4 |
|
$66.9400 / $78.7600 | Buy Now |
CAD Models for CYW15G0401DXB-BGXC by Cypress Semiconductor
Part Data Attributes for CYW15G0401DXB-BGXC by Cypress Semiconductor
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code
|
BGA
|
Package Description
|
LEAD FREE, BGA-256
|
Pin Count
|
256
|
Reach Compliance Code
|
not_compliant
|
HTS Code
|
8542.39.00.01
|
Data Rate
|
1500000 Mbps
|
JESD-30 Code
|
S-PBGA-B256
|
JESD-609 Code
|
e1
|
Length
|
27 mm
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
256
|
Number of Transceivers
|
4
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA256,20X20,50
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.745 mm
|
Supply Current-Max
|
1.1 mA
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
BICMOS
|
Telecom IC Type
|
TELECOM CIRCUIT
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
20
|
Width
|
27 mm
|
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