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Overview of CYP15G0401DX-BGC by Rochester Electronics LLC
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for CYP15G0401DX-BGC by Rochester Electronics LLC
Part Data Attributes for CYP15G0401DX-BGC by Rochester Electronics LLC
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Part Life Cycle Code
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Active
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Ihs Manufacturer
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ROCHESTER ELECTRONICS LLC
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Part Package Code
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BGA
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Package Description
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27 X 27 MM, 1.52 MM HEIGHT, THERMALLY ENHANCED, BGA-256
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Pin Count
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256
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Reach Compliance Code
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unknown
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JESD-30 Code
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S-PBGA-B256
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Length
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27 mm
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Number of Functions
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1
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Number of Terminals
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256
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Qualification Status
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COMMERCIAL
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Seated Height-Max
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1.745 mm
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Supply Voltage-Nom
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3.3 V
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Surface Mount
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YES
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Technology
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BICMOS
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Telecom IC Type
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TELECOM CIRCUIT
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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NOT SPECIFIED
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Terminal Form
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BALL
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Terminal Pitch
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1.27 mm
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Terminal Position
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BOTTOM
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Width
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27 mm
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