Part Details for CYG2217 by IXYS Integrated Circuits Division
Overview of CYG2217 by IXYS Integrated Circuits Division
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- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Part Details for CYG2217
CYG2217 CAD Models
CYG2217 Part Data Attributes
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CYG2217
IXYS Integrated Circuits Division
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Datasheet
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CYG2217
IXYS Integrated Circuits Division
IC MODEM-SUPPORT CIRCUIT, DMA9, 1.070 X 1.070 X 0.400 INCH MODULE-9, Modem
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | IXYS INTEGRATED CIRCUITS DIVISION | |
Part Package Code | DMA | |
Package Description | DIP, DIP18(UNSPEC) | |
Pin Count | 9 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-XDMA-P9 | |
JESD-609 Code | e0 | |
Number of Functions | 1 | |
Number of Terminals | 9 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | UNSPECIFIED | |
Package Code | DIP | |
Package Equivalence Code | DIP18(UNSPEC) | |
Package Shape | SQUARE | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Qualification Status | Not Qualified | |
Supply Current-Max | 0.006 mA | |
Supply Voltage-Nom | 5 V | |
Surface Mount | NO | |
Technology | HYBRID | |
Telecom IC Type | MODEM-SUPPORT CIRCUIT | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | PIN/PEG | |
Terminal Position | DUAL |