Part Details for CYG2021 by IXYS Integrated Circuits Division
Overview of CYG2021 by IXYS Integrated Circuits Division
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Renewable Energy
Telecommunications
Automotive
Robotics and Drones
Part Details for CYG2021
CYG2021 CAD Models
CYG2021 Part Data Attributes
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CYG2021
IXYS Integrated Circuits Division
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Datasheet
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CYG2021
IXYS Integrated Circuits Division
Modem-Support Circuit, Hybrid,
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | IXYS INTEGRATED CIRCUITS DIVISION | |
Package Description | DIP, DIP18(UNSPEC) | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | R-XDMA-P10 | |
JESD-609 Code | e0 | |
Number of Functions | 1 | |
Number of Terminals | 10 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | UNSPECIFIED | |
Package Code | DIP | |
Package Equivalence Code | DIP18(UNSPEC) | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Qualification Status | Not Qualified | |
Supply Current-Max | 0.009 mA | |
Supply Voltage-Nom | 5 V | |
Surface Mount | NO | |
Technology | HYBRID | |
Telecom IC Type | MODEM-SUPPORT CIRCUIT | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | PIN/PEG | |
Terminal Position | DUAL |