Part Details for CYD18S72V18-200BBXC by Infineon Technologies AG
Overview of CYD18S72V18-200BBXC by Infineon Technologies AG
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for CYD18S72V18-200BBXC
CYD18S72V18-200BBXC CAD Models
CYD18S72V18-200BBXC Part Data Attributes
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CYD18S72V18-200BBXC
Infineon Technologies AG
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Datasheet
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CYD18S72V18-200BBXC
Infineon Technologies AG
Multi-Port SRAM, 256KX72, 3.3ns, CMOS, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484 | |
| Reach Compliance Code | compliant | |
| Access Time-Max | 3.3 ns | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 72 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 484 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX72 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.16 mm | |
| Supply Voltage-Max (Vsup) | 1.58 V | |
| Supply Voltage-Min (Vsup) | 1.42 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm |
Alternate Parts for CYD18S72V18-200BBXC
This table gives cross-reference parts and alternative options found for CYD18S72V18-200BBXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CYD18S72V18-200BBXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CYD18S72V18-200BBI | Dual-Port SRAM, 256KX72, 3.3ns, CMOS, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484 | Cypress Semiconductor | CYD18S72V18-200BBXC vs CYD18S72V18-200BBI |
| CYD18S72V18-200BBXI | Multi-Port SRAM, 256KX72, 3.3ns, CMOS, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484 | Infineon Technologies AG | CYD18S72V18-200BBXC vs CYD18S72V18-200BBXI |
| CYD18S72V18-200BBC | Dual-Port SRAM, 256KX72, 3.3ns, CMOS, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484 | Cypress Semiconductor | CYD18S72V18-200BBXC vs CYD18S72V18-200BBC |