Part Details for CYD02S36V18-200BBXC by Cypress Semiconductor
Results Overview of CYD02S36V18-200BBXC by Cypress Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Aerospace and Defense
CYD02S36V18-200BBXC Information
CYD02S36V18-200BBXC by Cypress Semiconductor is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for CYD02S36V18-200BBXC
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
85978934
|
Verical | SRAM Chip Sync Dual 1.8V 2M-bit 64K x 36 9ns/5ns 256-Pin FBGA Tray RoHS: Compliant Min Qty: 2 Package Multiple: 1 Date Code: 1301 | Americas - 61 |
|
$238.8875 | Buy Now |
|
|
Rochester Electronics | Synchronous Sdr Dual-Port SRAM RoHS: Compliant Status: Obsolete Min Qty: 1 | 61 |
|
$162.4400 / $191.1100 | Buy Now |
Part Details for CYD02S36V18-200BBXC
CYD02S36V18-200BBXC CAD Models
CYD02S36V18-200BBXC Part Data Attributes
|
|
CYD02S36V18-200BBXC
Cypress Semiconductor
Buy Now
Datasheet
|
Compare Parts:
CYD02S36V18-200BBXC
Cypress Semiconductor
Dual-Port SRAM, 64KX36, 3.3ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, BGA-256
Select a part to compare: |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | BGA-256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 3.3 ns | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 2359296 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 256 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 64KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Standby Voltage-Min | 1.4 V | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm |