Part Details for CY9BF505NBBGL-GK6E1 by Cypress Semiconductor
Overview of CY9BF505NBBGL-GK6E1 by Cypress Semiconductor
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Part Details for CY9BF505NBBGL-GK6E1
CY9BF505NBBGL-GK6E1 CAD Models
CY9BF505NBBGL-GK6E1 Part Data Attributes
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CY9BF505NBBGL-GK6E1
Cypress Semiconductor
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CY9BF505NBBGL-GK6E1
Cypress Semiconductor
RISC Microcontroller, 32-Bit, FLASH, 80MHz, CMOS, PBGA112, FBGA-112
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | FBGA-112 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 25 | |
| Bit Size | 32 | |
| Clock Frequency-Max | 48 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PBGA-B112 | |
| Length | 10 mm | |
| Number of I/O Lines | 80 | |
| Number of Terminals | 112 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| RAM (bytes) | 49152 | |
| ROM (words) | 393216 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.45 mm | |
| Speed | 80 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 4.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |