There are no models available for this part yet.
Overview of CY9BF304RPMC-GE1 by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Price & Stock for CY9BF304RPMC-GE1 by Cypress Semiconductor
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
84AC9676
|
Newark | Cy9Bf304Rpmc-Ge1 |Cypress Infineon Technologies CY9BF304RPMC-GE1 RoHS: Not Compliant Min Qty: 84 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now |
CAD Models for CY9BF304RPMC-GE1 by Cypress Semiconductor
Part Data Attributes for CY9BF304RPMC-GE1 by Cypress Semiconductor
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
|
Package Description
|
LQFP-120
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.A.2
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|
HTS Code
|
8542.31.00.01
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Has ADC
|
YES
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|
Address Bus Width
|
25
|
|
Bit Size
|
32
|
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Clock Frequency-Max
|
48 MHz
|
|
DAC Channels
|
NO
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DMA Channels
|
YES
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External Data Bus Width
|
16
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JESD-30 Code
|
S-PQFP-G120
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Length
|
16 mm
|
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Number of I/O Lines
|
100
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Number of Terminals
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120
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On Chip Program ROM Width
|
8
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
|
-40 °C
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PWM Channels
|
YES
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
LFQFP
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Package Shape
|
SQUARE
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Package Style
|
FLATPACK, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
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|
RAM (bytes)
|
32768
|
|
ROM (words)
|
262144
|
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ROM Programmability
|
FLASH
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Seated Height-Max
|
1.7 mm
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Speed
|
80 MHz
|
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Supply Voltage-Max
|
5.5 V
|
|
Supply Voltage-Min
|
4.5 V
|
|
Supply Voltage-Nom
|
4.5 V
|
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Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.5 mm
|
|
Terminal Position
|
QUAD
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
16 mm
|
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER, RISC
|