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Part Details for CY8C6336BZI-BLD13 by Infineon Technologies AG
Overview of CY8C6336BZI-BLD13 by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY8C6336BZI-BLD13
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-CY8C6336BZI-BLD13-ND
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DigiKey | IC MCU 32BIT 512KB FLASH 116BGA Min Qty: 1820 Lead time: 13 Weeks Container: Tray | Temporarily Out of Stock |
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$6.4427 | Buy Now |
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DISTI #
727-CY8C6336BZIBLD13
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Mouser Electronics | ARM Microcontrollers - MCU PSOC6 USB, BLE, WiFi RoHS: Compliant | 0 |
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$6.3700 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1820 Package Multiple: 1 Lead time: 13 Weeks Container: Box | 0Box |
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$6.2500 | Buy Now |
Part Details for CY8C6336BZI-BLD13
CY8C6336BZI-BLD13 CAD Models
CY8C6336BZI-BLD13 Part Data Attributes
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CY8C6336BZI-BLD13
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY8C6336BZI-BLD13
Infineon Technologies AG
PSoC,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | Infineon | |
| JESD-30 Code | R-PBGA-B116 | |
| JESD-609 Code | e1 | |
| Length | 6.4 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 116 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA116,10X12,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Seated Height-Max | 0.7 mm | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 5.2 mm | |
| uPs/uCs/Peripheral ICs Type | Bluetooth SoC |
Resources and Additional Insights for CY8C6336BZI-BLD13
Reference Designs related to CY8C6336BZI-BLD13
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