Part Details for CY7S1041G30-10BVXIT by Infineon Technologies AG
Overview of CY7S1041G30-10BVXIT by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
Price & Stock for CY7S1041G30-10BVXIT
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-CY7S1041G30-10BVXITTR-ND
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DigiKey | IC SRAM 4MBIT PARALLEL 48VFBGA Min Qty: 2000 Lead time: 10 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$7.3352 | Buy Now |
DISTI #
CY7S1041G30-10BVXI
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Avnet Americas | ASYNC SRAMS - Tape and Reel (Alt: CY7S1041G30-10BVXI) RoHS: Not Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 10 Weeks, 0 Days Container: Reel | 0 |
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$7.4250 / $9.0750 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2000 Package Multiple: 2000 Container: Reel | 0Reel |
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$6.8800 | Buy Now |
Part Details for CY7S1041G30-10BVXIT
CY7S1041G30-10BVXIT CAD Models
CY7S1041G30-10BVXIT Part Data Attributes:
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CY7S1041G30-10BVXIT
Infineon Technologies AG
Buy Now
Datasheet
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CY7S1041G30-10BVXIT
Infineon Technologies AG
Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, VFBGA-48
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Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | VFBGA-48 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 10 Weeks | |
Access Time-Max | 10 ns | |
JESD-30 Code | R-PBGA-B48 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256KX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.2 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 6 mm |