Datasheets
CY7C2565KV18-400BZC by:

QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

Part Details for CY7C2565KV18-400BZC by Cypress Semiconductor

Overview of CY7C2565KV18-400BZC by Cypress Semiconductor

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Applications Internet of Things (IoT) Computing and Data Storage Agriculture Technology

Price & Stock for CY7C2565KV18-400BZC

Part # Distributor Description Stock Price Buy
Bristol Electronics   20
RFQ
Quest Components   2
  • 1 $2.8000
  • 3 $2.1000
$2.1000 / $2.8000 Buy Now
Rochester Electronics QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165 ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 89
  • 1 $474.6300
  • 25 $465.1300
  • 100 $446.1500
  • 500 $427.1600
  • 1,000 $403.4300
$403.4300 / $474.6300 Buy Now

Part Details for CY7C2565KV18-400BZC

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CY7C2565KV18-400BZC Part Data Attributes:

CY7C2565KV18-400BZC Cypress Semiconductor
Buy Now Datasheet
Compare Parts:
CY7C2565KV18-400BZC Cypress Semiconductor QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Pin Count 165
Reach Compliance Code not_compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 400 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
Length 15 mm
Memory Density 75497472 bit
Memory IC Type QDR SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.32 A
Standby Voltage-Min 1.7 V
Supply Current-Max 1 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

Alternate Parts for CY7C2565KV18-400BZC

This table gives cross-reference parts and alternative options found for CY7C2565KV18-400BZC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C2565KV18-400BZC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C2565KV18-400BZXI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C2565KV18-400BZC vs CY7C2565KV18-400BZXI
CY7C2565KV18-400BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C2565KV18-400BZC vs CY7C2565KV18-400BZI
Part Number Description Manufacturer Compare
IS61QDP2B42M36A1-300M3L QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc CY7C2565KV18-400BZC vs IS61QDP2B42M36A1-300M3L
IS61DDPB22M36A-500M3I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc CY7C2565KV18-400BZC vs IS61DDPB22M36A-500M3I
CY7C1565KV18-500BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C2565KV18-400BZC vs CY7C1565KV18-500BZI
GS8662D38BGD-400I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C2565KV18-400BZC vs GS8662D38BGD-400I
CY7C1515JV18-167BZI QDR SRAM, 2MX36, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C2565KV18-400BZC vs CY7C1515JV18-167BZI
GS8662T38AE-300IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C2565KV18-400BZC vs GS8662T38AE-300IT
GS8662D36BD-350IT QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C2565KV18-400BZC vs GS8662D36BD-350IT
GS8662Q37BGD-357I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C2565KV18-400BZC vs GS8662Q37BGD-357I
CY7C2565KV18-450BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C2565KV18-400BZC vs CY7C2565KV18-450BZI
GS8662D36BGD-350IT QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C2565KV18-400BZC vs GS8662D36BGD-350IT

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