We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In
Memory / SRAMs / CY7C2564XV18-450BZXC
Datasheets
CY7C2564XV18-450BZXC by:
Cypress Semiconductor
Cypress Semiconductor
Infineon Technologies AG
Not Found

QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165

Part Details for CY7C2564XV18-450BZXC by Cypress Semiconductor

Results Overview of CY7C2564XV18-450BZXC by Cypress Semiconductor

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Computing and Data Storage Financial Technology (Fintech)

CY7C2564XV18-450BZXC Information

CY7C2564XV18-450BZXC by Cypress Semiconductor is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for CY7C2564XV18-450BZXC

Part # Distributor Description Stock Price Buy
Rochester Electronics QDR SRAM, 4MX18, 0.45ns PBGA165 RoHS: Compliant Status: Active Min Qty: 1 113
  • 1 $226.5300
  • 25 $222.0000
  • 100 $212.9400
  • 500 $203.8800
  • 1,000 $192.5500
$192.5500 / $226.5300 Buy Now
Flip Electronics Stock, ship today 110
RFQ

Part Details for CY7C2564XV18-450BZXC

CY7C2564XV18-450BZXC CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

CY7C2564XV18-450BZXC Part Data Attributes

Parametric Data
CY7C2564XV18-450BZXC Cypress Semiconductor
Buy Now Datasheet
Compare Parts:
CY7C2564XV18-450BZXC Cypress Semiconductor QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165
Select a part to compare:
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description FBGA-165
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 450 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 75497472 bit
Memory IC Type QDR SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 1.445 A
Standby Voltage-Min 1.7 V
Supply Current-Max 1.445 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm

Alternate Parts for CY7C2564XV18-450BZXC

This table gives cross-reference parts and alternative options found for CY7C2564XV18-450BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C2564XV18-450BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
CY7C2564XV18-450BZC Infineon Technologies AG Check for Price QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 CY7C2564XV18-450BZXC vs CY7C2564XV18-450BZC
Part Number Manufacturer Composite Price Description Compare
CY7C2564XV18-450BZXC Infineon Technologies AG Check for Price QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 CY7C2564XV18-450BZXC vs CY7C2564XV18-450BZXC

CY7C2564XV18-450BZXC Related Parts

CY7C2564XV18-450BZXC Frequently Asked Questions (FAQ)

  • The CY7C2564XV18-450BZXC has an industrial temperature range of -40°C to +85°C, and a commercial temperature range of 0°C to +70°C.

  • The CY7C2564XV18-450BZXC has a self-refresh mode that can be enabled by setting the SREF bit in the Mode Register (MR). This mode reduces power consumption by automatically refreshing the memory array.

  • The CY7C2564XV18-450BZXC supports a maximum clock frequency of 450 MHz.

  • The CY7C2564XV18-450BZXC has a built-in error detection and correction mechanism using ECC (Error-Correcting Code). The device also provides a Write Error flag that can be used to detect and handle errors during write operations.

  • The CY7C2564XV18-450BZXC is designed to operate at a voltage supply of 1.8V. However, it is possible to use it in a system with a different voltage supply, but it would require an external voltage regulator and level translators to ensure compatibility.