Part Details for CY7C2563XV18-600BZC by Cypress Semiconductor
Results Overview of CY7C2563XV18-600BZC by Cypress Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CY7C2563XV18-600BZC Information
CY7C2563XV18-600BZC by Cypress Semiconductor is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for CY7C2563XV18-600BZC
Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165 RoHS: Not Compliant Status: Active Min Qty: 1 | 125 |
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$379.4300 / $446.3900 | Buy Now |
Part Details for CY7C2563XV18-600BZC
CY7C2563XV18-600BZC CAD Models
CY7C2563XV18-600BZC Part Data Attributes
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CY7C2563XV18-600BZC
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
CY7C2563XV18-600BZC
Cypress Semiconductor
QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | FBGA-165 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 600 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 2MX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 235 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 1.1 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 1.1 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 13 mm |
Alternate Parts for CY7C2563XV18-600BZC
This table gives cross-reference parts and alternative options found for CY7C2563XV18-600BZC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C2563XV18-600BZC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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CY7C2563XV18-600BZXC | Cypress Semiconductor | Check for Price | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | CY7C2563XV18-600BZC vs CY7C2563XV18-600BZXC |