Datasheets
CY7C2563XV18-600BZC by:
Cypress Semiconductor
Cypress Semiconductor
Infineon Technologies AG
Not Found

QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165

Part Details for CY7C2563XV18-600BZC by Cypress Semiconductor

Results Overview of CY7C2563XV18-600BZC by Cypress Semiconductor

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Applications Healthcare Medical Imaging Robotics and Drones

CY7C2563XV18-600BZC Information

CY7C2563XV18-600BZC by Cypress Semiconductor is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for CY7C2563XV18-600BZC

Part # Distributor Description Stock Price Buy
Rochester Electronics QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165 RoHS: Not Compliant Status: Active Min Qty: 1 125
  • 1 $446.3900
  • 25 $437.4600
  • 100 $419.6100
  • 500 $401.7500
  • 1,000 $379.4300
$379.4300 / $446.3900 Buy Now

Part Details for CY7C2563XV18-600BZC

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CY7C2563XV18-600BZC Part Data Attributes

CY7C2563XV18-600BZC Cypress Semiconductor
Buy Now Datasheet
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CY7C2563XV18-600BZC Cypress Semiconductor QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165
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Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description FBGA-165
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 600 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e0
Length 15 mm
Memory Density 75497472 bit
Memory IC Type QDR SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 1.1 A
Standby Voltage-Min 1.7 V
Supply Current-Max 1.1 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 13 mm

Alternate Parts for CY7C2563XV18-600BZC

This table gives cross-reference parts and alternative options found for CY7C2563XV18-600BZC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C2563XV18-600BZC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
CY7C2563XV18-600BZXC Cypress Semiconductor Check for Price QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 CY7C2563XV18-600BZC vs CY7C2563XV18-600BZXC
Part Number Manufacturer Composite Price Description Compare
CY7C2563XV18-600BZC Infineon Technologies AG Check for Price QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 CY7C2563XV18-600BZC vs CY7C2563XV18-600BZC

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