Part Details for CY7C1668KV18-450BZXC by Infineon Technologies AG
Overview of CY7C1668KV18-450BZXC by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY7C1668KV18-450BZXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CY7C1668KV18-450BZXC-ND
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DigiKey | IC SRAM 144MBIT PAR 165FBGA Min Qty: 525 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
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$307.9829 | Buy Now |
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DISTI #
CY7C1668KV18-450BZ
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Avnet Americas | SRAM Chip Sync Single 1.8V 144M-Bit 8M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1668KV18-450BZ) RoHS: Compliant Min Qty: 525 Package Multiple: 525 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 525 Package Multiple: 525 Lead time: 11 Weeks | 0 |
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$299.0200 | Buy Now |
Part Details for CY7C1668KV18-450BZXC
CY7C1668KV18-450BZXC CAD Models
CY7C1668KV18-450BZXC Part Data Attributes
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CY7C1668KV18-450BZXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1668KV18-450BZXC
Infineon Technologies AG
DDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 11 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 15 mm |