Part Details for CY7C1625KV18-333BZXC by Cypress Semiconductor
Results Overview of CY7C1625KV18-333BZXC by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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CY7C1625KV18-333BZXC Information
CY7C1625KV18-333BZXC by Cypress Semiconductor is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for CY7C1625KV18-333BZXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-CY7C1625KV18-333BZXC-ND
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DigiKey | IC SRAM 144MBIT PAR 165FBGA Min Qty: 1 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
93 In Stock |
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$309.3300 | Buy Now |
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DISTI #
85973269
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Verical | SRAM Chip Sync Dual 1.8V 144M-bit 16M x 9-bit 0.45ns 165-Pin FBGA Tray RoHS: Compliant Min Qty: 2 Package Multiple: 1 Date Code: 1101 | Americas - 92 |
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$371.7875 | Buy Now |
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Rochester Electronics | QDR SRAM, 16MX9, 0.45ns PBGA165 RoHS: Compliant pbFree: No Status: Active Min Qty: 1 | 93 |
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$252.8200 / $297.4300 | Buy Now |
Part Details for CY7C1625KV18-333BZXC
CY7C1625KV18-333BZXC CAD Models
CY7C1625KV18-333BZXC Part Data Attributes
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CY7C1625KV18-333BZXC
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
CY7C1625KV18-333BZXC
Cypress Semiconductor
QDR SRAM, 16MX9, 0.45ns, CMOS, PBGA165, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | FBGA-165 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 150994944 bit | |
| Memory IC Type | QDR II SRAM | |
| Memory Width | 9 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 16MX9 | |
| Output Characteristics | 3-STATE | |
| Output Enable | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.41 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.95 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |