Datasheets
CY7C1613KV18-333BZXC by:
Cypress Semiconductor
Cypress Semiconductor
Infineon Technologies AG
Not Found

QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165

Part Details for CY7C1613KV18-333BZXC by Cypress Semiconductor

Results Overview of CY7C1613KV18-333BZXC by Cypress Semiconductor

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

CY7C1613KV18-333BZXC Information

CY7C1613KV18-333BZXC by Cypress Semiconductor is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for CY7C1613KV18-333BZXC

Part # Distributor Description Stock Price Buy
DISTI # 2156-CY7C1613KV18-333BZXC-ND
DigiKey IC SRAM 144MBIT PAR 165FBGA Min Qty: 2 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT 126
In Stock
  • 2 $296.1700
$296.1700 Buy Now
Rochester Electronics QDR SRAM, 8MX18, 0.45ns PBGA165 RoHS: Compliant pbFree: No Status: Active Min Qty: 1 126
  • 1 $284.7800
  • 25 $279.0800
  • 100 $267.6900
  • 500 $256.3000
  • 1,000 $242.0600
$242.0600 / $284.7800 Buy Now
Flip Electronics Stock 60
RFQ

Part Details for CY7C1613KV18-333BZXC

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CY7C1613KV18-333BZXC Part Data Attributes

CY7C1613KV18-333BZXC Cypress Semiconductor
Buy Now Datasheet
Compare Parts:
CY7C1613KV18-333BZXC Cypress Semiconductor QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description FBGA-165
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 333 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 17 mm
Memory Density 150994944 bit
Memory IC Type QDR SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 1.7 V
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 15 mm

Alternate Parts for CY7C1613KV18-333BZXC

This table gives cross-reference parts and alternative options found for CY7C1613KV18-333BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1613KV18-333BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
CY7C1613KV18-333BZXC Infineon Technologies AG Check for Price QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165 CY7C1613KV18-333BZXC vs CY7C1613KV18-333BZXC

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