Datasheets
CY7C1570V18-333BZXI by: Cypress Semiconductor

DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

Part Details for CY7C1570V18-333BZXI by Cypress Semiconductor

Overview of CY7C1570V18-333BZXI by Cypress Semiconductor

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for CY7C1570V18-333BZXI

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CY7C1570V18-333BZXI Part Data Attributes

CY7C1570V18-333BZXI Cypress Semiconductor
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CY7C1570V18-333BZXI Cypress Semiconductor DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 333 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 17 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 36
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 1.7 V
Supply Current-Max 1.2 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm

Alternate Parts for CY7C1570V18-333BZXI

This table gives cross-reference parts and alternative options found for CY7C1570V18-333BZXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1570V18-333BZXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8662R36BD-333IT Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8662R36BD-333IT
GS8662T36BD-333I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8662T36BD-333I
GS8662R36BD-333I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8662R36BD-333I
GS8662T36BD-333IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8662T36BD-333IT
CY7C1520KV18-333BZXI DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Infineon Technologies AG CY7C1570V18-333BZXI vs CY7C1520KV18-333BZXI
GS8672T36BGE-333IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8672T36BGE-333IT
GS8662R36BGD-333IT Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8662R36BGD-333IT
GS8672T36BE-333I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8672T36BE-333I
GS8672T36BE-333IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8672T36BE-333IT
GS8662T36BGD-333I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8662T36BGD-333I
Part Number Description Manufacturer Compare
GS8672Q36AGE-333T Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8672Q36AGE-333T
GS8672D37BE-400I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8672D37BE-400I
IS61DDPB42M36A-500M3L DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc CY7C1570V18-333BZXI vs IS61DDPB42M36A-500M3L
GS8672D36BE-333I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8672D36BE-333I
K7J643682M-EI300 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 Samsung Semiconductor CY7C1570V18-333BZXI vs K7J643682M-EI300
CY7C1565V18-333BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C1570V18-333BZXI vs CY7C1565V18-333BZI
UPD44644365F5-E37-FQ1 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 NEC Electronics Group CY7C1570V18-333BZXI vs UPD44644365F5-E37-FQ1
CY7C1565KV18-550BZXI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C1570V18-333BZXI vs CY7C1565KV18-550BZXI
GS8672T38BE-633 Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8672T38BE-633
GS8662S36BGD-167T Standard SRAM, 2MX36, 0.5ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 GSI Technology CY7C1570V18-333BZXI vs GS8662S36BGD-167T

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