Part Details for CY7C1525KV18-300BZC by Infineon Technologies AG
Overview of CY7C1525KV18-300BZC by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1525KV18-300BZC
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CY7C1525KV18-300BZC-ND
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DigiKey | IC SRAM 72MBIT PARALLEL 165FBGA Min Qty: 680 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
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$132.5095 | Buy Now |
DISTI #
CY7C1525KV18-300BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1525KV18-300BZ) RoHS: Not Compliant Min Qty: 680 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$159.5260 | Buy Now |
DISTI #
727-CY7C1525KV18300C
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Mouser Electronics | SRAM 72MB (8Mx9) 1.8v 300MHz QDR II SRAM RoHS: Not Compliant | 0 |
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$129.5400 | Order Now |
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Future Electronics | CY7C1525KV18 Series 72 M (8M x 9) QDR® II SRAM Two-Word Burst Architecture RoHS: Non Compliant pbFree: No Min Qty: 680 Package Multiple: 136 Container: Tray | 0Tray |
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$127.0000 | Buy Now |
Part Details for CY7C1525KV18-300BZC
CY7C1525KV18-300BZC CAD Models
CY7C1525KV18-300BZC Part Data Attributes:
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CY7C1525KV18-300BZC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1525KV18-300BZC
Infineon Technologies AG
QDR II SRAM, 8MX9, 0.45ns, CMOS, PBGA165,
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Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
Factory Lead Time | 11 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V | |
Clock Frequency-Max (fCLK) | 300 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | QDR II SRAM | |
Memory Width | 9 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8MX9 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 220 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.73 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 13 mm |
Alternate Parts for CY7C1525KV18-300BZC
This table gives cross-reference parts and alternative options found for CY7C1525KV18-300BZC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1525KV18-300BZC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS8662D09BGD-300 | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1525KV18-300BZC vs GS8662D09BGD-300 |
GS8662DT11BD-350I | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1525KV18-300BZC vs GS8662DT11BD-350I |
GS8662D09BD-250 | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1525KV18-300BZC vs GS8662D09BD-250 |
GS8662DT11BGD-500I | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1525KV18-300BZC vs GS8662DT11BGD-500I |
GS8662TT11BGD-350 | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1525KV18-300BZC vs GS8662TT11BGD-350 |
GS8662D10BD-333I | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1525KV18-300BZC vs GS8662D10BD-333I |
GS8662D11BD-450I | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1525KV18-300BZC vs GS8662D11BD-450I |
GS8662Q09BD-333 | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1525KV18-300BZC vs GS8662Q09BD-333 |
GS8662QT10BGD-200 | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1525KV18-300BZC vs GS8662QT10BGD-200 |
GS8662D09BD-333I | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1525KV18-300BZC vs GS8662D09BD-333I |