There are no models available for this part yet.
Overview of CY7C1518KV18-300BZC by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Space Technology
Computing and Data Storage
Aerospace and Defense
Price & Stock for CY7C1518KV18-300BZC by Cypress Semiconductor
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Rochester Electronics | CY7C1518KV18 - DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165 ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 590 |
|
$115.9800 / $136.4400 | Buy Now |
CAD Models for CY7C1518KV18-300BZC by Cypress Semiconductor
Part Data Attributes for CY7C1518KV18-300BZC by Cypress Semiconductor
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
|
Part Package Code
|
BGA
|
|
Package Description
|
13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
0.45 ns
|
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
300 MHz
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
Length
|
15 mm
|
|
Memory Density
|
75497472 bit
|
|
Memory IC Type
|
DDR SRAM
|
|
Memory Width
|
18
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
4194304 words
|
|
Number of Words Code
|
4000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
4MX18
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA165,11X15,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.4 mm
|
|
Standby Voltage-Min
|
1.7 V
|
|
Supply Current-Max
|
0.49 mA
|
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
13 mm
|
Alternate Parts for CY7C1518KV18-300BZC
This table gives cross-reference parts and alternative options found for CY7C1518KV18-300BZC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1518KV18-300BZC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K7I641882M-FC300 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 | Samsung Semiconductor | CY7C1518KV18-300BZC vs K7I641882M-FC300 |
| GS8662T18BD-300 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1518KV18-300BZC vs GS8662T18BD-300 |
| GS8662T18BGD-300 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1518KV18-300BZC vs GS8662T18BGD-300 |
| CY7C1518V18-300BZC | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1518KV18-300BZC vs CY7C1518V18-300BZC |
| GS8672T18BGE-300T | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | GSI Technology | CY7C1518KV18-300BZC vs GS8672T18BGE-300T |
| CY7C1518AV18-300BZXC | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1518KV18-300BZC vs CY7C1518AV18-300BZXC |
| GS8662T18BD-300T | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1518KV18-300BZC vs GS8662T18BD-300T |
| CY7C1568V18-300BZXC | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1518KV18-300BZC vs CY7C1568V18-300BZXC |
| CY7C1518JV18-300BZXC | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1518KV18-300BZC vs CY7C1518JV18-300BZXC |
| CY7C1518KV18-300BZXC | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Infineon Technologies AG | CY7C1518KV18-300BZC vs CY7C1518KV18-300BZXC |