Part Details for CY7C1512KV18-300BZXI by Cypress Semiconductor
Overview of CY7C1512KV18-300BZXI by Cypress Semiconductor
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- Number of FFF Equivalents:
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- Number of Functional Equivalents:
- Part Data Attributes
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY7C1512KV18-300BZXI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
50R9320
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Newark | Sync Srams/Tray |Cypress Infineon Technologies CY7C1512KV18-300BZXI Min Qty: 680 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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Bristol Electronics | 109 |
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RFQ | ||
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Rochester Electronics | CY7C1512KV18 - QDR SRAM, 4MX18, 0.45ns PBGA165 RoHS: Compliant Status: Active Min Qty: 1 | 36 |
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$127.5800 / $150.0900 | Buy Now |
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Flip Electronics | Stock | 901 |
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RFQ |
Part Details for CY7C1512KV18-300BZXI
CY7C1512KV18-300BZXI CAD Models
CY7C1512KV18-300BZXI Part Data Attributes
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CY7C1512KV18-300BZXI
Cypress Semiconductor
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Datasheet
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CY7C1512KV18-300BZXI
Cypress Semiconductor
QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | FBGA-165 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.75 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 13 mm |
Alternate Parts for CY7C1512KV18-300BZXI
This table gives cross-reference parts and alternative options found for CY7C1512KV18-300BZXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1512KV18-300BZXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS61QDB24M18A-300B3LI | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, LEAD FREE, TFBGA-165 | Integrated Silicon Solution Inc | CY7C1512KV18-300BZXI vs IS61QDB24M18A-300B3LI |
| GS8672Q18BE-300I | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXI vs GS8672Q18BE-300I |
| GS8662Q18BGD-300I | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXI vs GS8662Q18BGD-300I |
| IS61QDB24M18A-300B3I | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, TFBGA-165 | Integrated Silicon Solution Inc | CY7C1512KV18-300BZXI vs IS61QDB24M18A-300B3I |
| CY7C1512KV18-300BZXI | QDR II SRAM, 4MX18, 0.45ns, CMOS, PBGA165, | Infineon Technologies AG | CY7C1512KV18-300BZXI vs CY7C1512KV18-300BZXI |
| IS61QDB24M18A-300M3LI | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | CY7C1512KV18-300BZXI vs IS61QDB24M18A-300M3LI |
| GS8672Q18BGE-300I | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXI vs GS8672Q18BGE-300I |
| GS8662Q18BGD-300IT | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXI vs GS8662Q18BGD-300IT |
| GS8672Q18BGE-300IT | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXI vs GS8672Q18BGE-300IT |
| IS61QDB24M18A-300M3I | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | CY7C1512KV18-300BZXI vs IS61QDB24M18A-300M3I |