Part Details for CY7C1512KV18-300BZXC by Cypress Semiconductor
Overview of CY7C1512KV18-300BZXC by Cypress Semiconductor
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY7C1512KV18-300BZXC
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 2 |
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RFQ | ||
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Rochester Electronics | CY7C1512KV18 - QDR SRAM, 4MX18, 0.45ns PBGA165 ' RoHS: Compliant Status: Active Min Qty: 1 | 391 |
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$127.5800 / $150.0900 | Buy Now |
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Chip1Cloud | 72-Mbit QDR-II SRAM 2-Word Burst Architecture | 1550 |
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RFQ | |
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Flip Electronics | Stock, ship today | 294 |
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$61.7500 | RFQ |
Part Details for CY7C1512KV18-300BZXC
CY7C1512KV18-300BZXC CAD Models
CY7C1512KV18-300BZXC Part Data Attributes:
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CY7C1512KV18-300BZXC
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
CY7C1512KV18-300BZXC
Cypress Semiconductor
QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | FBGA-165 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V | |
Clock Frequency-Max (fCLK) | 300 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 4MX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.75 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 13 mm |
Alternate Parts for CY7C1512KV18-300BZXC
This table gives cross-reference parts and alternative options found for CY7C1512KV18-300BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1512KV18-300BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
GS8672Q18BGE-300T | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXC vs GS8672Q18BGE-300T |
GS8672Q18BE-300 | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXC vs GS8672Q18BE-300 |
GS8672Q18BE-300T | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXC vs GS8672Q18BE-300T |
GS8662Q18BD-300 | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXC vs GS8662Q18BD-300 |
IS61QDB24M18-300M3L | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | CY7C1512KV18-300BZXC vs IS61QDB24M18-300M3L |
GS8662Q18BD-300T | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXC vs GS8662Q18BD-300T |
GS8672Q18BGE-300 | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1512KV18-300BZXC vs GS8672Q18BGE-300 |
IS61QDB24M18A-300M3 | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | CY7C1512KV18-300BZXC vs IS61QDB24M18A-300M3 |
IS61QDB24M18A-300B3L | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, LEAD FREE, TFBGA-165 | Integrated Silicon Solution Inc | CY7C1512KV18-300BZXC vs IS61QDB24M18A-300B3L |
CY7C1512KV18-300BZC | QDR II SRAM, 4MX18, 0.45ns, CMOS, PBGA165, | Infineon Technologies AG | CY7C1512KV18-300BZXC vs CY7C1512KV18-300BZC |