Part Details for CY7C1420AV18-200BZC by Cypress Semiconductor
Overview of CY7C1420AV18-200BZC by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for CY7C1420AV18-200BZC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
86099184
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Verical | CY7C1420AV18-200BZC Min Qty: 7 Package Multiple: 1 Date Code: 1001 | Americas - 2110 |
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$45.8250 / $53.9125 | Buy Now |
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DISTI #
86098953
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Verical | CY7C1420AV18-200BZC Min Qty: 7 Package Multiple: 1 | Americas - 279 |
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$45.8250 / $53.9125 | Buy Now |
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Rochester Electronics | DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165 ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 3508 |
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$36.6600 / $43.1300 | Buy Now |
Part Details for CY7C1420AV18-200BZC
CY7C1420AV18-200BZC CAD Models
CY7C1420AV18-200BZC Part Data Attributes
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CY7C1420AV18-200BZC
Cypress Semiconductor
Buy Now
Datasheet
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CY7C1420AV18-200BZC
Cypress Semiconductor
DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | |
| Pin Count | 165 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.315 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.675 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 15 mm |