Part Details for CY7C1415KV18-300BZXI by Infineon Technologies AG
Overview of CY7C1415KV18-300BZXI by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
Price & Stock for CY7C1415KV18-300BZXI
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CY7C1415KV18-300BZXI-ND
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DigiKey | IC SRAM 36MBIT PARALLEL 165FBGA Min Qty: 1360 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
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$41.4318 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: No Min Qty: 1360 Package Multiple: 1360 Container: Tray | 0Tray |
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$40.2300 | Buy Now |
Part Details for CY7C1415KV18-300BZXI
CY7C1415KV18-300BZXI CAD Models
CY7C1415KV18-300BZXI Part Data Attributes:
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CY7C1415KV18-300BZXI
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1415KV18-300BZXI
Infineon Technologies AG
QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, FBGA-165
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Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | FBGA-165 | |
Reach Compliance Code | compliant | |
Access Time-Max | 0.45 ns | |
Clock Frequency-Max (fCLK) | 300 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 37748736 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1MX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.27 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.73 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 13 mm |
Alternate Parts for CY7C1415KV18-300BZXI
This table gives cross-reference parts and alternative options found for CY7C1415KV18-300BZXI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1415KV18-300BZXI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY7C1415KV18-300BZXC | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | CY7C1415KV18-300BZXI vs CY7C1415KV18-300BZXC |