Part Details for CY7C1412KV18-300BZXC by Infineon Technologies AG
Overview of CY7C1412KV18-300BZXC by Infineon Technologies AG
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Computing and Data Storage
Energy and Power Systems
Price & Stock for CY7C1412KV18-300BZXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CY7C1412KV18-300BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1412KV18-300BZ) RoHS: Compliant Min Qty: 272 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$49.8790 | Buy Now |
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DISTI #
727-C1412KV18300BZXC
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Mouser Electronics | SRAM 36MB (2Mx18) 1.8v 300MHz QDR II SRAM RoHS: Compliant | 0 |
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$42.5500 | Order Now |
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Future Electronics | SRAM - Synchronous, QDR II Memory IC 36Mb (2M x 18) Parallel 300MHz 165-FBGA (13 RoHS: Compliant pbFree: Yes Min Qty: 272 Package Multiple: 136 Container: Tray | 0Tray |
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$42.5500 | Buy Now |
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DISTI #
78451157
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Verical | SRAM Chip Sync Dual 1.8V 36M-bit 2M x 18 0.45ns 165-Pin FBGA Tray Min Qty: 1 Package Multiple: 1 Date Code: 2401 | Americas - 247 |
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$43.0359 / $60.1971 | Buy Now |
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DISTI #
CY7C1412KV18-300BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1412KV18-300BZ) RoHS: Compliant Min Qty: 272 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$49.8790 | Buy Now |
|
DISTI #
SP005639119
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EBV Elektronik | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray (Alt: SP005639119) RoHS: Compliant Min Qty: 272 Package Multiple: 272 Lead time: 1 Weeks, 5 Days | EBV - 0 |
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Buy Now |
Part Details for CY7C1412KV18-300BZXC
CY7C1412KV18-300BZXC CAD Models
CY7C1412KV18-300BZXC Part Data Attributes:
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CY7C1412KV18-300BZXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1412KV18-300BZXC
Infineon Technologies AG
QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 11 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX18 | |
| Output Characteristics | 3-STATE | |
| Output Enable | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.27 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.7 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 mm |