Datasheets
CY7C1412AV18-250BZXC by:

QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

Part Details for CY7C1412AV18-250BZXC by Cypress Semiconductor

Overview of CY7C1412AV18-250BZXC by Cypress Semiconductor

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Price & Stock for CY7C1412AV18-250BZXC

Part # Distributor Description Stock Price Buy
Rochester Electronics CY7C1412AV18 - 36 Mbit (2M x 18), QDR II SRAM Two Word Burst Architecture RoHS: Compliant Status: Rochester Active Min Qty: 1 58
RFQ

Part Details for CY7C1412AV18-250BZXC

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CY7C1412AV18-250BZXC Part Data Attributes

CY7C1412AV18-250BZXC Cypress Semiconductor
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CY7C1412AV18-250BZXC Cypress Semiconductor QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Pin Count 165
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 250 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 17 mm
Memory Density 37748736 bit
Memory IC Type QDR SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.35 A
Standby Voltage-Min 1.7 V
Supply Current-Max 1.06 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm

Alternate Parts for CY7C1412AV18-250BZXC

This table gives cross-reference parts and alternative options found for CY7C1412AV18-250BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1412AV18-250BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1412AV18-250BZXI QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C1412AV18-250BZXC vs CY7C1412AV18-250BZXI
CY7C1412AV18-250BZC QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C1412AV18-250BZXC vs CY7C1412AV18-250BZC
CY7C1412AV18-250BZI QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C1412AV18-250BZXC vs CY7C1412AV18-250BZI
Part Number Description Manufacturer Compare
GS8342DT20BD-400IT QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1412AV18-250BZXC vs GS8342DT20BD-400IT
CY7C1412AV18-250BZXI QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor CY7C1412AV18-250BZXC vs CY7C1412AV18-250BZXI
R1Q2A3618BBG-40RT 2MX18 QDR SRAM, PBGA165, 15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165 Renesas Electronics Corporation CY7C1412AV18-250BZXC vs R1Q2A3618BBG-40RT
GS8342DT20BD-400I QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1412AV18-250BZXC vs GS8342DT20BD-400I
R1Q2A3618BBG-40R 2MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165 Renesas Electronics Corporation CY7C1412AV18-250BZXC vs R1Q2A3618BBG-40R
GS8342DT20BGD-400I QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C1412AV18-250BZXC vs GS8342DT20BGD-400I
CY7C1412AV18-250BZC QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor CY7C1412AV18-250BZXC vs CY7C1412AV18-250BZC
GS8342DT19BGD-400 QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C1412AV18-250BZXC vs GS8342DT19BGD-400
GS8342DT20BGD-400T QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology CY7C1412AV18-250BZXC vs GS8342DT20BGD-400T
GS8342DT20BD-400 QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology CY7C1412AV18-250BZXC vs GS8342DT20BD-400

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