Part Details for CY7C1383C-100BGI by Cypress Semiconductor
Overview of CY7C1383C-100BGI by Cypress Semiconductor
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Applications
Education and Research
Space Technology
Computing and Data Storage
Aerospace and Defense
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 71T75802S100BGI | Renesas Electronics Corporation | 2.5V 1M X 18 ZBT Synchronous 2.5V I/O PipeLine SRAM | |
| 71V2556SA100BGI8 | Renesas Electronics Corporation | 3.3V 128Kx36 ZBT Synchronous PipeLined SRAM with 2.5V I/O | |
| 71V3556SA100BGI | Renesas Electronics Corporation | 3.3V 128Kx36 ZBT Synchronous PipeLined SRAM with 3.3V I/O |
Part Details for CY7C1383C-100BGI
CY7C1383C-100BGI CAD Models
CY7C1383C-100BGI Part Data Attributes
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CY7C1383C-100BGI
Cypress Semiconductor
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CY7C1383C-100BGI
Cypress Semiconductor
Standard SRAM, 1MX18, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | |
| Pin Count | 119 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 8.5 ns | |
| Additional Feature | FLOW-THROUGH ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 100 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e0 | |
| Length | 22 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.4 mm | |
| Standby Current-Max | 0.07 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.175 mA | |
| Supply Voltage-Max (Vsup) | 3.63 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |