Datasheets
CY7C1382C-167BZC by: Cypress Semiconductor

Cache SRAM, 1MX18, 3.4ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165

Part Details for CY7C1382C-167BZC by Cypress Semiconductor

Results Overview of CY7C1382C-167BZC by Cypress Semiconductor

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CY7C1382C-167BZC Information

CY7C1382C-167BZC by Cypress Semiconductor is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Part Details for CY7C1382C-167BZC

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CY7C1382C-167BZC Part Data Attributes

CY7C1382C-167BZC Cypress Semiconductor
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CY7C1382C-167BZC Cypress Semiconductor Cache SRAM, 1MX18, 3.4ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3.4 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
JESD-609 Code e0
Length 15 mm
Memory Density 18874368 bit
Memory IC Type CACHE SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.07 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.275 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm