Part Details for CY7C1373BV25-117AC by Rochester Electronics LLC
Overview of CY7C1373BV25-117AC by Rochester Electronics LLC
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
R5F117ACGSP#50 | Renesas Electronics Corporation | Microcontrollers Suitable for Applications such as Detectors and Sensors Requiring Low Power and Analog Integration | |
R5F117ACGSP#30 | Renesas Electronics Corporation | Microcontrollers Suitable for Applications such as Detectors and Sensors Requiring Low Power and Analog Integration | |
R5F117ACGSP#10 | Renesas Electronics Corporation | Microcontrollers Suitable for Applications such as Detectors and Sensors Requiring Low Power and Analog Integration |
Part Details for CY7C1373BV25-117AC
CY7C1373BV25-117AC CAD Models
CY7C1373BV25-117AC Part Data Attributes
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CY7C1373BV25-117AC
Rochester Electronics LLC
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CY7C1373BV25-117AC
Rochester Electronics LLC
1MX18 ZBT SRAM, 7.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | QFP | |
Package Description | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | unknown | |
Access Time-Max | 7.5 ns | |
Additional Feature | FLOW-THROUGH ARCHITECTURE | |
JESD-30 Code | R-PQFP-G100 | |
JESD-609 Code | e0 | |
Length | 20 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | NOT SPECIFIED | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1MX18 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 1.6 mm | |
Supply Voltage-Max (Vsup) | 2.625 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |