Datasheets
CY7C1360V25-200BAC by: Cypress Semiconductor

Cache SRAM, 256KX36, 3.1ns, CMOS, PBGA119, FBGA-119

Part Details for CY7C1360V25-200BAC by Cypress Semiconductor

Overview of CY7C1360V25-200BAC by Cypress Semiconductor

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for CY7C1360V25-200BAC

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CY7C1360V25-200BAC Part Data Attributes

CY7C1360V25-200BAC Cypress Semiconductor
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CY7C1360V25-200BAC Cypress Semiconductor Cache SRAM, 256KX36, 3.1ns, CMOS, PBGA119, FBGA-119
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description FBGA-119
Pin Count 119
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3.1 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B119
JESD-609 Code e0
Memory Density 9437184 bit
Memory IC Type CACHE SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 119
Number of Words 262144 words
Number of Words Code 256000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA119(UNSPEC)
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Standby Current-Max 0.01 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.45 mA
Supply Voltage-Max (Vsup) 2.625 V
Supply Voltage-Min (Vsup) 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Alternate Parts for CY7C1360V25-200BAC

This table gives cross-reference parts and alternative options found for CY7C1360V25-200BAC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1360V25-200BAC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1379C-100AXC ZBT SRAM, 256KX32, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 Cypress Semiconductor CY7C1360V25-200BAC vs CY7C1379C-100AXC
IBM0436A81QLAB-3P Standard SRAM, 256KX36, 1.5ns, CMOS, PBGA119, BGA-119 IBM CY7C1360V25-200BAC vs IBM0436A81QLAB-3P
K7B801825M-HC100 Cache SRAM, 512KX18, 10ns, CMOS, PBGA119, BGA-119 Samsung Semiconductor CY7C1360V25-200BAC vs K7B801825M-HC100
CXK77S36L80AGB-42A Late-Write SRAM, 256KX36, 4.1ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 Sony Semiconductor CY7C1360V25-200BAC vs CXK77S36L80AGB-42A
IDT71V65703S80B ZBT SRAM, 256KX36, 8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-026AA, BGA-119 Integrated Device Technology Inc CY7C1360V25-200BAC vs IDT71V65703S80B
AS7C3512K18P-4TQC Standard SRAM, 512KX18, 4ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Alliance Semiconductor Corporation CY7C1360V25-200BAC vs AS7C3512K18P-4TQC
MCM63Z836TZP166R ZBT SRAM, 256KX36, 3.6ns, CMOS, PBGA119, PLASTIC, BGA-119 Motorola Semiconductor Products CY7C1360V25-200BAC vs MCM63Z836TZP166R
CXK77P36L80GB-42B Late-Write SRAM, 256KX36, 4ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 Sony Semiconductor CY7C1360V25-200BAC vs CXK77P36L80GB-42B
IS61LPS25632T-250TQ Cache SRAM, 256KX32, 2.6ns, CMOS, PQFP100, TQFP-100 Integrated Silicon Solution Inc CY7C1360V25-200BAC vs IS61LPS25632T-250TQ
UPD4382361GF-A90B Cache SRAM, 256KX36, 9ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 NEC Electronics Group CY7C1360V25-200BAC vs UPD4382361GF-A90B

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