Part Details for CY7C1338B-117BGC by Cypress Semiconductor
Overview of CY7C1338B-117BGC by Cypress Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for CY7C1338B-117BGC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-CY7C1338B-117BGC-ND
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DigiKey | IC SRAM 4MBIT PAR 117MHZ 119PBGA Min Qty: 58 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
365 In Stock |
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$5.2500 | Buy Now |
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Rochester Electronics | Cache SRAM, 128KX32, 7.5ns PBGA119 ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 365 |
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$4.2900 / $5.0500 | Buy Now |
Part Details for CY7C1338B-117BGC
CY7C1338B-117BGC CAD Models
CY7C1338B-117BGC Part Data Attributes
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CY7C1338B-117BGC
Cypress Semiconductor
Buy Now
Datasheet
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CY7C1338B-117BGC
Cypress Semiconductor
Cache SRAM, 128KX32, 7.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | |
| Pin Count | 119 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 7.5 ns | |
| Additional Feature | FLOW-THROUGH ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 117 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e0 | |
| Length | 22 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 32 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.4 mm | |
| Standby Current-Max | 0.01 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.35 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |