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Overview of CY7C1321KV18-250BZXC by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for CY7C1321KV18-250BZXC by Infineon Technologies AG
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
CY7C1321KV18-250BZ
|
Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1321KV18-250BZ) RoHS: Compliant Min Qty: 34 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 1819 Partner Stock |
|
$18.2776 / $22.1100 | Buy Now | |
DISTI #
CY7C1321KV18-250BZ
|
Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1321KV18-250BZ) RoHS: Compliant Min Qty: 15 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 226 Partner Stock |
|
$19.9500 / $24.6500 | Buy Now | |
DISTI #
CY7C1321KV18-250BZ
|
Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1321KV18-250BZ) RoHS: Compliant Min Qty: 680 Package Multiple: 136 Container: Tray | 0 |
|
RFQ | ||
Future Electronics | RoHS: Compliant pbFree: No Min Qty: 680 Package Multiple: 680 Lead time: 11 Weeks | 0 |
|
$21.1300 | Buy Now |
CAD Models for CY7C1321KV18-250BZXC by Infineon Technologies AG
Part Data Attributes for CY7C1321KV18-250BZXC by Infineon Technologies AG
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|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
Package Description
|
13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216BB0AC, FBGA-165
|
Reach Compliance Code
|
compliant
|
Access Time-Max
|
0.45 ns
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK)
|
250 MHz
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e1
|
Length
|
15 mm
|
Memory Density
|
18874368 bit
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Memory IC Type
|
DDR SRAM
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Memory Width
|
36
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
524288 words
|
Number of Words Code
|
512000
|
Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
512KX36
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Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
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Package Code
|
LBGA
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Package Equivalence Code
|
BGA165,11X15,40
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Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
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Parallel/Serial
|
SERIAL
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.4 mm
|
Standby Current-Max
|
0.25 A
|
Standby Voltage-Min
|
1.7 V
|
Supply Current-Max
|
0.37 mA
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
13 mm
|