Memory SRAMs CY7C1320JV18-300BZC

CY7C1320JV18-300BZC by

Description: 512KX36 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

Overview of CY7C1320JV18-300BZC by Rochester Electronics LLC

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Show differences only	CY7C1320JV18-300BZC Rochester Electronics LLC Buy Now	part-to-be-compared Rochester Electronics LLC Buy Now
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Part Life Cycle Code	Active
Ihs Manufacturer	ROCHESTER ELECTRONICS LLC
Part Package Code	BGA
Package Description	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Pin Count	165
Reach Compliance Code	unknown
Access Time-Max	0.45 ns
Additional Feature	PIPELINED ARCHITECTURE
JESD-30 Code	R-PBGA-B165
Length	15 mm
Memory Density	18874368 bit
Memory IC Type	DDR SRAM
Memory Width	36
Number of Functions	1
Number of Terminals	165
Number of Words	524288 words
Number of Words Code	512000
Operating Mode	SYNCHRONOUS
Operating Temperature-Max	70 °C
Operating Temperature-Min
Organization	512KX36
Package Body Material	PLASTIC/EPOXY
Package Code	LBGA
Package Shape	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Qualification Status	COMMERCIAL
Seated Height-Max	1.4 mm
Supply Voltage-Max (Vsup)	1.9 V
Supply Voltage-Min (Vsup)	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V
Surface Mount	YES
Temperature Grade	COMMERCIAL
Terminal Form	BALL
Terminal Pitch	1 mm
Terminal Position	BOTTOM
Width	13 mm

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