Part Details for CY7C1318KV18-300BZXC by Infineon Technologies AG
Overview of CY7C1318KV18-300BZXC by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (7 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1318KV18-300BZXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2832-CY7C1318KV18-300BZXC-ND
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DigiKey | IC SRAM 18MBIT PARALLEL 165FBGA Min Qty: 25 Lead time: 11 Weeks Container: Tray MARKETPLACE PRODUCT |
136 In Stock |
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$24.8500 | Buy Now |
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DISTI #
CY7C1318KV18-300BZXC-ND
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DigiKey | IC SRAM 18MBIT PARALLEL 165FBGA Min Qty: 25 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
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$28.2842 | Buy Now |
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DISTI #
CY7C1318KV18-300BZ
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Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray (Alt: CY7C1318KV18-300BZ) RoHS: Compliant Min Qty: 27 Package Multiple: 1 Lead time: 0 Weeks, 2 Days | 0 |
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$24.5916 / $27.9450 | Buy Now |
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DISTI #
CY7C1318KV18-300BZ
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Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1318KV18-300BZ) RoHS: Compliant Min Qty: 680 Package Multiple: 680 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$25.8335 / $28.3955 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 680 Package Multiple: 680 Lead time: 11 Weeks | 0 |
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$26.6900 | Buy Now |
Part Details for CY7C1318KV18-300BZXC
CY7C1318KV18-300BZXC CAD Models
CY7C1318KV18-300BZXC Part Data Attributes
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CY7C1318KV18-300BZXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1318KV18-300BZXC
Infineon Technologies AG
DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 11 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.26 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.43 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 mm |
Alternate Parts for CY7C1318KV18-300BZXC
This table gives cross-reference parts and alternative options found for CY7C1318KV18-300BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1318KV18-300BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1318CV18-300BZC | DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1318KV18-300BZXC vs CY7C1318CV18-300BZC |
| CY7C1318CV18-300BZXI | DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1318KV18-300BZXC vs CY7C1318CV18-300BZXI |
| CY7C1318BV18-300BZI | DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1318KV18-300BZXC vs CY7C1318BV18-300BZI |
| CY7C1318KV18-300BZXC | DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | CY7C1318KV18-300BZXC vs CY7C1318KV18-300BZXC |
| CY7C1318CV18-300BZXC | DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1318KV18-300BZXC vs CY7C1318CV18-300BZXC |
| CY7C1318BV18-300BZC | DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1318KV18-300BZXC vs CY7C1318BV18-300BZC |
| CY7C1318CV18-300BZI | DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1318KV18-300BZXC vs CY7C1318CV18-300BZI |