Part Details for CY7C1302DV25-167BZXC by Cypress Semiconductor
Overview of CY7C1302DV25-167BZXC by Cypress Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Healthcare
Price & Stock for CY7C1302DV25-167BZXC
Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | QDR SRAM, 512KX18, 2.5ns PBGA165 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 20 |
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$27.2700 / $32.0800 | Buy Now |
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Flip Electronics | Stock, ship today | 224 |
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$15.3400 | RFQ |
Part Details for CY7C1302DV25-167BZXC
CY7C1302DV25-167BZXC CAD Models
CY7C1302DV25-167BZXC Part Data Attributes:
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CY7C1302DV25-167BZXC
Cypress Semiconductor
Buy Now
Datasheet
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CY7C1302DV25-167BZXC
Cypress Semiconductor
QDR SRAM, 512KX18, 2.5ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 2.5 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 167 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 9437184 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.24 A | |
Standby Voltage-Min | 2.4 V | |
Supply Current-Max | 0.5 mA | |
Supply Voltage-Max (Vsup) | 2.6 V | |
Supply Voltage-Min (Vsup) | 2.4 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 13 mm |