Part Details for CY7C1163KV18-400BZI by Infineon Technologies AG
Overview of CY7C1163KV18-400BZI by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1163KV18-400BZI
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CY7C1163KV18-400BZI-ND
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DigiKey | IC SRAM 18MBIT PARALLEL 165FBGA Min Qty: 136 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
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$36.6755 | Buy Now |
DISTI #
CY7C1163KV18-400BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray (Alt: CY7C1163KV18-400BZ) RoHS: Not Compliant Min Qty: 24 Package Multiple: 1 Lead time: 0 Weeks, 2 Days | 3738 Partner Stock |
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$26.7716 / $32.3850 | Buy Now |
DISTI #
CY7C1163KV18-400BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1163KV18-400BZ) RoHS: Not Compliant Min Qty: 10 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 559 Partner Stock |
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$30.3500 / $37.4900 | Buy Now |
DISTI #
CY7C1163KV18-400BZ
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Avnet Americas | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1163KV18-400BZ) RoHS: Not Compliant Min Qty: 136 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
DISTI #
727-7C1163KV18400BZI
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Mouser Electronics | SRAM 18MB (1Mx18) 1.8v 400MHz DDR II SRAM RoHS: Not Compliant | 0 |
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Order Now |
Part Details for CY7C1163KV18-400BZI
CY7C1163KV18-400BZI CAD Models
CY7C1163KV18-400BZI Part Data Attributes
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CY7C1163KV18-400BZI
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1163KV18-400BZI
Infineon Technologies AG
QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, FBGA-165
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Rohs Code | No | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | FBGA-165 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 2 Days | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 400 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1MX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.29 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.61 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 13 mm |
Alternate Parts for CY7C1163KV18-400BZI
This table gives cross-reference parts and alternative options found for CY7C1163KV18-400BZI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1163KV18-400BZI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
GS8182D36BD-375MT | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1163KV18-400BZI vs GS8182D36BD-375MT |
CY7C1243KV18-450BZC | QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | CY7C1163KV18-400BZI vs CY7C1243KV18-450BZC |
CY7C1393KV18-333BZI | DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FPBGA-165 | Infineon Technologies AG | CY7C1163KV18-400BZI vs CY7C1393KV18-333BZI |
GS8182D08BD-375M | QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1163KV18-400BZI vs GS8182D08BD-375M |
GS8161E36DD-200V | Cache SRAM, 512KX36, 6.5ns, CMOS, PBGA165, FPBGA-165 | GSI Technology | CY7C1163KV18-400BZI vs GS8161E36DD-200V |
IS64LF25618A-7.5TQA3 | 256KX18 CACHE SRAM, 7.5ns, PQFP100, TQFP-100 | Integrated Silicon Solution Inc | CY7C1163KV18-400BZI vs IS64LF25618A-7.5TQA3 |
K7M163645A-FI160 | ZBT SRAM, 512KX36, CMOS, PBGA165, FBGA-165 | Samsung Semiconductor | CY7C1163KV18-400BZI vs K7M163645A-FI160 |
GS832118AGD-150VT | Cache SRAM, 2MX18, 7.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 | GSI Technology | CY7C1163KV18-400BZI vs GS832118AGD-150VT |
IS61NVP25618A-200TQ | 256KX18 ZBT SRAM, 3.1ns, PQFP100, TQFP-100 | Integrated Silicon Solution Inc | CY7C1163KV18-400BZI vs IS61NVP25618A-200TQ |
CY7C1418KV18-333BZC | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Infineon Technologies AG | CY7C1163KV18-400BZI vs CY7C1418KV18-333BZC |