Part Details for CY7C1062G30-10BGXIT by Infineon Technologies AG
Overview of CY7C1062G30-10BGXIT by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for CY7C1062G30-10BGXIT
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-CY7C1062G30-10BGXITTR-ND
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DigiKey | IC SRAM 16MBIT PARALLEL 119PBGA Min Qty: 500 Lead time: 10 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$42.2844 | Buy Now |
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DISTI #
CY7C1062G30-10BGXI
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Avnet Americas | SRAM Chip Async Single 3V 16M-Bit 512K x 32 10ns 119-Pin BGA T/R - Tape and Reel (Alt: CY7C1062G30-10BGXI) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 10 Weeks, 0 Days Container: Reel | 0 |
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$48.7630 | Buy Now |
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DISTI #
727-CY7C1062G30BGXIT
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Mouser Electronics | SRAM ASYNC RoHS: Compliant | 0 |
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$40.7100 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 500 Package Multiple: 500 Container: Reel | 0Reel |
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$39.3300 | Buy Now |
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DISTI #
SP005641515
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EBV Elektronik | (Alt: SP005641515) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 11 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for CY7C1062G30-10BGXIT
CY7C1062G30-10BGXIT CAD Models
CY7C1062G30-10BGXIT Part Data Attributes:
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CY7C1062G30-10BGXIT
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1062G30-10BGXIT
Infineon Technologies AG
Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, BGA-119
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | BGA-119 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 10 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 10 ns | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e1 | |
| Length | 22 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 32 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.4 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.2 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |