Part Details for CY7C1061G18-15BV1XI by Cypress Semiconductor
Overview of CY7C1061G18-15BV1XI by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Price & Stock for CY7C1061G18-15BV1XI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
86106824
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Verical | SRAM Chip Async Single 1.8V 16M-bit 1M x 16 15ns 48-Pin VFBGA Tray RoHS: Compliant Min Qty: 8 Package Multiple: 1 Date Code: 1801 | Americas - 324 |
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$40.5750 / $47.7375 | Buy Now |
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DISTI #
86102412
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Verical | SRAM Chip Async Single 1.8V 16M-bit 1M x 16 15ns 48-Pin VFBGA Tray RoHS: Compliant Min Qty: 8 Package Multiple: 1 Date Code: 1501 | Americas - 25 |
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$40.5750 / $47.7375 | Buy Now |
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Rochester Electronics | CY7C1061G18 - Standard SRAM, 1MX16, 15ns PBGA48 RoHS: Compliant Status: Active Min Qty: 1 | 324 |
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$32.4600 / $38.1900 | Buy Now |
Part Details for CY7C1061G18-15BV1XI
CY7C1061G18-15BV1XI CAD Models
CY7C1061G18-15BV1XI Part Data Attributes
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CY7C1061G18-15BV1XI
Cypress Semiconductor
Buy Now
Datasheet
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CY7C1061G18-15BV1XI
Cypress Semiconductor
Standard SRAM, 1MX16, 15ns, CMOS, PBGA48, VFBGA-48
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 15 ns | |
| JESD-30 Code | R-PBGA-B48 | |
| JESD-609 Code | e1 | |
| Length | 8 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 2.2 V | |
| Supply Voltage-Min (Vsup) | 1.65 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm |