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Overview of CY62147CV33LL-70BAI by Cypress Semiconductor
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for CY62147CV33LL-70BAI by Cypress Semiconductor
Part Data Attributes for CY62147CV33LL-70BAI by Cypress Semiconductor
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|---|---|
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Rohs Code
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No
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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CYPRESS SEMICONDUCTOR CORP
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Part Package Code
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BGA
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Package Description
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TFBGA, BGA48,6X8,30
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Pin Count
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48
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Reach Compliance Code
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not_compliant
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ECCN Code
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3A991.B.2.A
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HTS Code
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8542.32.00.41
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Access Time-Max
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70 ns
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I/O Type
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COMMON
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JESD-30 Code
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R-PBGA-B48
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JESD-609 Code
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e0
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Length
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8.5 mm
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Memory Density
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4194304 bit
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Memory IC Type
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STANDARD SRAM
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Memory Width
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16
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Number of Functions
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1
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Number of Terminals
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48
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Number of Words
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262144 words
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Number of Words Code
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256000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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Organization
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256KX16
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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TFBGA
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Package Equivalence Code
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BGA48,6X8,30
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, THIN PROFILE, FINE PITCH
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Parallel/Serial
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PARALLEL
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Qualification Status
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Not Qualified
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Seated Height-Max
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1.2 mm
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Standby Current-Max
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0.00001 A
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Standby Voltage-Min
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1.5 V
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Supply Current-Max
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0.015 mA
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Supply Voltage-Max (Vsup)
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3.6 V
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Supply Voltage-Min (Vsup)
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3 V
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Supply Voltage-Nom (Vsup)
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Finish
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Tin/Lead (Sn/Pb)
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Terminal Form
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BALL
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Terminal Pitch
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0.75 mm
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Terminal Position
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BOTTOM
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Width
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7 mm
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