Part Details for CY14V101QS-BK108XI by Cypress Semiconductor
Overview of CY14V101QS-BK108XI by Cypress Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Telecommunications
Renewable Energy
Robotics and Drones
Price & Stock for CY14V101QS-BK108XI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
16AC3229
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Newark | Nv Sram, 128K X 8Bit, Fbga-24, Memory Size:1Mbit, Memory Organisation:128K X 8Bit, Read Access Time:10Ns, Write Access Time:10Ns, Supply Voltage Min:2.7V, Supply Voltage Max:3.6V, Memory Case Style:Fbga, No. Of Pins:24Pins, Ic Rohs Compliant: Yes |Cypress Infineon Technologies CY14V101QS-BK108XI RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$11.7500 / $14.7600 | Buy Now |
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Flip Electronics | Stock, ship today | 14869 |
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RFQ |
Part Details for CY14V101QS-BK108XI
CY14V101QS-BK108XI CAD Models
CY14V101QS-BK108XI Part Data Attributes
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CY14V101QS-BK108XI
Cypress Semiconductor
Buy Now
Datasheet
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CY14V101QS-BK108XI
Cypress Semiconductor
Non-Volatile SRAM, 128KX8, CMOS, PBGA24, FBGA-24
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | FBGA-24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| JESD-30 Code | R-PBGA-B24 | |
| JESD-609 Code | e1 | |
| Length | 8 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | NON-VOLATILE SRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm |