Part Details for CY14V101LA-BA25XI by Cypress Semiconductor
Results Overview of CY14V101LA-BA25XI by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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CY14V101LA-BA25XI Information
CY14V101LA-BA25XI by Cypress Semiconductor is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for CY14V101LA-BA25XI
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 2 |
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RFQ | ||
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Rochester Electronics | Non-Volatile SRAM, 128KX8, 25ns PBGA48 RoHS: Compliant Status: Active Min Qty: 1 | 1604 |
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$18.6000 / $21.8800 | Buy Now |
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Flip Electronics | Stock, ship today | 3648 |
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RFQ |
Part Details for CY14V101LA-BA25XI
CY14V101LA-BA25XI CAD Models
CY14V101LA-BA25XI Part Data Attributes
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CY14V101LA-BA25XI
Cypress Semiconductor
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Datasheet
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CY14V101LA-BA25XI
Cypress Semiconductor
Non-Volatile SRAM, 128KX8, 25ns, CMOS, PBGA48, 6 X 10 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, FBGA-48
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | 6 X 10 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, FBGA-48 | |
Pin Count | 48 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 25 ns | |
JESD-30 Code | R-PBGA-B48 | |
JESD-609 Code | e1 | |
Length | 10 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | NON-VOLATILE SRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA48,6X8,30 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Standby Current-Max | 0.008 A | |
Supply Current-Max | 0.07 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 6 mm |