Datasheets
CXP82000-U01Q by: Sony Semiconductor

Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100

Part Details for CXP82000-U01Q by Sony Semiconductor

Overview of CXP82000-U01Q by Sony Semiconductor

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

Part Details for CXP82000-U01Q

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CXP82000-U01Q Part Data Attributes

CXP82000-U01Q Sony Semiconductor
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CXP82000-U01Q Sony Semiconductor Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer SONY CORP
Part Package Code QFP
Package Description AQFP,
Pin Count 100
Reach Compliance Code unknown
HTS Code 8542.31.00.01
JESD-30 Code R-CQFP-G100
JESD-609 Code e4
Length 22.3 mm
Number of Terminals 100
Operating Temperature-Max 75 °C
Operating Temperature-Min -20 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code AQFP
Package Shape RECTANGULAR
Package Style FLATPACK, PIGGYBACK
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 10.44 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish Gold (Au)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 10
Width 16.3 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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