Part Details for CXK77R1882AGB-35 by Sony Semiconductor
Overview of CXK77R1882AGB-35 by Sony Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for CXK77R1882AGB-35
CXK77R1882AGB-35 CAD Models
CXK77R1882AGB-35 Part Data Attributes
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CXK77R1882AGB-35
Sony Semiconductor
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Datasheet
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CXK77R1882AGB-35
Sony Semiconductor
DDR SRAM, 512KX18, 2.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SONY CORP | |
Part Package Code | BGA | |
Package Description | BGA, BGA153,9X17,50 | |
Pin Count | 153 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 2.2 ns | |
Clock Frequency-Max (fCLK) | 285 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B153 | |
JESD-609 Code | e0 | |
Length | 22 mm | |
Memory Density | 9437184 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 18 | |
Number of Functions | 1 | |
Number of Terminals | 153 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 512KX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA153,9X17,50 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.3 mm | |
Standby Current-Max | 0.44 A | |
Standby Voltage-Min | 2.38 V | |
Supply Current-Max | 0.88 mA | |
Supply Voltage-Max (Vsup) | 2.63 V | |
Supply Voltage-Min (Vsup) | 2.37 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |
Alternate Parts for CXK77R1882AGB-35
This table gives cross-reference parts and alternative options found for CXK77R1882AGB-35. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CXK77R1882AGB-35, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MCM64E918RS3.0R | DDR SRAM, 512KX18, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 | Motorola Semiconductor Products | CXK77R1882AGB-35 vs MCM64E918RS3.0R |
MCM64E918RS3.0 | 512KX18 DDR SRAM, 0.2ns, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 | Motorola Mobility LLC | CXK77R1882AGB-35 vs MCM64E918RS3.0 |
MCM64E918RS4.0R | DDR SRAM, 512KX18, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 | Motorola Semiconductor Products | CXK77R1882AGB-35 vs MCM64E918RS4.0R |
IBM0418A8CBLBB-4H | Standard SRAM, 512KX18, 2.25ns, CMOS, PBGA153, BGA-153 | IBM | CXK77R1882AGB-35 vs IBM0418A8CBLBB-4H |
IBM0418A8CBLBB-3 | Standard SRAM, 512KX18, 2ns, CMOS, PBGA153, BGA-153 | IBM | CXK77R1882AGB-35 vs IBM0418A8CBLBB-3 |
K7D801871C-HC330 | DDR SRAM, 512KX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | Samsung Semiconductor | CXK77R1882AGB-35 vs K7D801871C-HC330 |
MCM64E918FC3.3 | 512KX18 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 | Motorola Mobility LLC | CXK77R1882AGB-35 vs MCM64E918FC3.3 |
MCM64E918RS3.3R | 512KX18 DDR SRAM, 0.2ns, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 | Motorola Mobility LLC | CXK77R1882AGB-35 vs MCM64E918RS3.3R |
MCM64E918RS3.3 | DDR SRAM, 512KX18, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 | Motorola Semiconductor Products | CXK77R1882AGB-35 vs MCM64E918RS3.3 |
MCM64E918RS4.4R | DDR SRAM, 512KX18, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 | Motorola Semiconductor Products | CXK77R1882AGB-35 vs MCM64E918RS4.4R |