Datasheets
CXK77Q36B160GB-28 by: Sony Semiconductor

Late-Write SRAM, 512KX36, 1.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119

Part Details for CXK77Q36B160GB-28 by Sony Semiconductor

Overview of CXK77Q36B160GB-28 by Sony Semiconductor

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Renewable Energy Robotics and Drones

Part Details for CXK77Q36B160GB-28

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CXK77Q36B160GB-28 Part Data Attributes

CXK77Q36B160GB-28 Sony Semiconductor
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CXK77Q36B160GB-28 Sony Semiconductor Late-Write SRAM, 512KX36, 1.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SONY CORP
Part Package Code BGA
Package Description BGA, BGA119,7X17,50
Pin Count 119
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 1.5 ns
Clock Frequency-Max (fCLK) 357 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119
JESD-609 Code e0
Length 22 mm
Memory Density 18874368 bit
Memory IC Type LATE-WRITE SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 119
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.5 mm
Standby Current-Max 0.25 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.93 mA
Supply Voltage-Max (Vsup) 2.63 V
Supply Voltage-Min (Vsup) 2.37 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm

Alternate Parts for CXK77Q36B160GB-28

This table gives cross-reference parts and alternative options found for CXK77Q36B160GB-28. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CXK77Q36B160GB-28, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MCM69F817ZP6 256KX18 CACHE SRAM, 6ns, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 Motorola Mobility LLC CXK77Q36B160GB-28 vs MCM69F817ZP6
IBM043640QLAA-6 Standard SRAM, 128KX36, 7.5ns, CMOS, PBGA119, BGA-119 IBM CXK77Q36B160GB-28 vs IBM043640QLAA-6
IS61DDP2B21M36A-400B4L DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc CXK77Q36B160GB-28 vs IS61DDP2B21M36A-400B4L
K7N401801A-TC160 ZBT SRAM, 256KX18, 3.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Samsung Semiconductor CXK77Q36B160GB-28 vs K7N401801A-TC160
K7P163612M-HC48 Standard SRAM, 512KX36, 4.8ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FLIP CHIP, BGA-119 Samsung Semiconductor CXK77Q36B160GB-28 vs K7P163612M-HC48
KM732V789H-67 Cache SRAM, 128KX32, 3.8ns, CMOS, PBGA119, BGA-119 Samsung Semiconductor CXK77Q36B160GB-28 vs KM732V789H-67
IS61VPS10018-166TQ Cache SRAM, 1MX18, 3.5ns, CMOS, PQFP100, TQFP-100 Integrated Silicon Solution Inc CXK77Q36B160GB-28 vs IS61VPS10018-166TQ
IS61QDPB21M36A-333B4I QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc CXK77Q36B160GB-28 vs IS61QDPB21M36A-333B4I
MCM69F817ZP6.5R 256KX18 CACHE SRAM, 6.5ns, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 Motorola Mobility LLC CXK77Q36B160GB-28 vs MCM69F817ZP6.5R
K7I163684B-FC330 DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 Samsung Semiconductor CXK77Q36B160GB-28 vs K7I163684B-FC330

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