Part Details for CXK77P18L80AGB-4 by Sony Semiconductor
Overview of CXK77P18L80AGB-4 by Sony Semiconductor
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for CXK77P18L80AGB-4
CXK77P18L80AGB-4 CAD Models
CXK77P18L80AGB-4 Part Data Attributes
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CXK77P18L80AGB-4
Sony Semiconductor
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Datasheet
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CXK77P18L80AGB-4
Sony Semiconductor
Late-Write SRAM, 512KX18, 3.9ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SONY CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA119,7X17,50 | |
| Pin Count | 119 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 3.9 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e0 | |
| Length | 22 mm | |
| Memory Density | 9437184 bit | |
| Memory IC Type | LATE-WRITE SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.4 mm | |
| Standby Current-Max | 0.1 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.6 mA | |
| Supply Voltage-Max (Vsup) | 3.47 V | |
| Supply Voltage-Min (Vsup) | 3.13 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |