Part Details for CXA1386P by Sony Semiconductor
Overview of CXA1386P by Sony Semiconductor
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Applications
Environmental Monitoring
Industrial Automation
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Part Details for CXA1386P
CXA1386P CAD Models
CXA1386P Part Data Attributes
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CXA1386P
Sony Semiconductor
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Datasheet
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CXA1386P
Sony Semiconductor
ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, Bipolar, PDIP28, 0.600 INCH, PLASTIC, DIP-28
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SONY CORP | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Analog Input Voltage-Max | ||
Analog Input Voltage-Min | -2 V | |
Converter Type | ADC, FLASH METHOD | |
JESD-30 Code | R-PDIP-T28 | |
JESD-609 Code | e6 | |
Length | 37.8 mm | |
Linearity Error-Max (EL) | 0.1953% | |
Negative Supply Voltage-Nom | -5.2 V | |
Number of Analog In Channels | 1 | |
Number of Bits | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | -20 °C | |
Output Bit Code | BINARY | |
Output Format | PARALLEL, 8 BITS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Sample Rate | 75 MHz | |
Seated Height-Max | 5 mm | |
Surface Mount | NO | |
Technology | BIPOLAR | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | Tin/Bismuth (Sn/Bi) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 10 | |
Width | 15.24 mm |