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Overview of CX28250-23 by Mindspeed Technologies Inc
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- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for CX28250-23 by Mindspeed Technologies Inc
Part Data Attributes for CX28250-23 by Mindspeed Technologies Inc
|
|
---|---|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
MINDSPEED TECHNOLOGIES INC
|
Part Package Code
|
BGA
|
Package Description
|
BGA,
|
Pin Count
|
156
|
Reach Compliance Code
|
compliant
|
HTS Code
|
8542.39.00.01
|
JESD-30 Code
|
S-PBGA-B156
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Length
|
15 mm
|
Number of Functions
|
1
|
Number of Terminals
|
156
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
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Qualification Status
|
Not Qualified
|
Seated Height-Max
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1.97 mm
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Telecom IC Type
|
ATM/SONET/SDH NETWORK INTERFACE
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Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
BALL
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Terminal Pitch
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1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
15 mm
|