Part Details for CS6422-ISZ by Cirrus Logic
Results Overview of CS6422-ISZ by Cirrus Logic
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
CS6422-ISZ Information
CS6422-ISZ by Cirrus Logic is a Telephone Circuit.
Telephone Circuits are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for CS6422-ISZ
CS6422-ISZ CAD Models
CS6422-ISZ Part Data Attributes
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CS6422-ISZ
Cirrus Logic
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Datasheet
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Compare Parts:
CS6422-ISZ
Cirrus Logic
Speaker Phone Circuit, PDSO20, 0.300 INCH, LEAD FREE, MS-013, SOIC-20
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CIRRUS LOGIC INC | |
| Part Package Code | SOIC | |
| Package Description | SOP, SOP20,.4 | |
| Pin Count | 20 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-PDSO-G20 | |
| JESD-609 Code | e3 | |
| Length | 12.8 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP20,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.65 mm | |
| Supply Current-Max | 0.08 mA | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Telecom IC Type | SPEAKER PHONE CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 7.5 mm |
Alternate Parts for CS6422-ISZ
This table gives cross-reference parts and alternative options found for CS6422-ISZ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CS6422-ISZ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| CS6422-IS | Cirrus Logic | Check for Price | Speaker Phone Circuit, PDSO20, 0.300 INCH, MS-013, SOIC-20 | CS6422-ISZ vs CS6422-IS |
CS6422-ISZ Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
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Use a high-quality, low-ESR capacitor (e.g., 10uF) for power supply decoupling, and place it as close as possible to the device. Ensure the power supply is clean and regulated, and use a ferrite bead or inductor to filter out high-frequency noise.
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Use a high-quality, low-jitter clock source (e.g., a crystal oscillator) and ensure the clock signal is properly terminated and routed. The CS6422-ISZ can also be clocked from an external source, such as a clock generator or a system clock.
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Use a high-quality, low-noise analog power supply, and ensure the analog input signals are properly filtered and terminated. Keep the analog input signals away from digital signals, and use a separate analog ground plane to minimize noise coupling.
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Use a heat sink or thermal pad to dissipate heat, especially in high-power applications. Ensure good airflow around the device, and avoid blocking the thermal pads or heat sink. Monitor the device temperature and adjust the thermal management strategy accordingly.